Research and Development
PFT has a dedicated team in R&D who keep themselves abreast
of market trend and industry development. They do extensive
research on product applications, the latest manufacturing technologies
as well as new industry and international standards. Close communications
with the Sales and Marketing team gives a good understanding
of the needs of our customers. With the assistance of the latest
CAD technology and our accumulated know-how in the memory business,
we have mastered 4-layer to 8-layer PCB design in compliance
with industry standards and / or customers’ specific requirements.
Procurement and Manufacturing
All PCBs are manufactured by PFT approved vendors who are the
leading companies in their profession. We have a stringent policy
on components procurement. Incoming quality control system is
also in place.
We use the “Do Right In the First Time” (DRIFT)
principle for all aspects of work. Manufacturability, failure
mode and effect analysis, quality control plan, to name a few,
are all incorporated in our engineering and manufacturing workflow.
Quality Control - Verification and
Validation
We confirm a new design with a comprehensive verification and validation
scheme to ensure the highest possible quality of our products. Functional
test, burn-in test, compatibility test, reliability test, validation
test from Intel approved laboratory, and test on real applications are
an integral part of our quality control system. PFT is the one and only
manufacturer in Hong Kong that can qualify its products with Intel.
View validation results from Intel
and CMTL
Case Study: Module using Stacked Chips
High capacity module is always needed for high-end applications
such as workstations and servers. However, high capacity memory
chip is expensive. So, chip stacking is a promising solution.
Some companies develop stacked chips in the die-level. They
package more than one die in a chip. On the other hand, some
companies provide solutions in the chip-level. For example,
they mount the chips on two PCBs and connect them by a flexible
cable.
AT PFT, we deliver our own solution in order to maintain the
price in an acceptable level. Also, we wish to have a better
control on the product quality and reliability as most of the
stacking modules are used in workstations or servers for non-stop
running. To achieve our goals, manufacturing technology is a
big challenge. How do we stack the chips? How do we assemble
the module by stacked chips? All the work must be done cost-effectively
with a quick turnaround time.
We have developed a special PCB that supports stacked chip
and we have introduced a new assembly method specially designed
for stacking modules. As soon as the stacked chips are ready,
modules are built by a specially designed assembly process.
These modules have all undergone a strict reliability test to
guarantee that all the solder joints and the components are
functionally good even in an extreme environment.
Now, our customers can get the high capacity stacking module
in our product line. They are good quality in a reasonable price.